You are on page 1of 5

Semiconductor Memory Types & Technologies

Semiconductor memory is used in all forms of computer applications: there are many types
and technologies that are used..

Semiconductor memory is used in any electronics assembly that uses computer processing
technology.

In addition to this, memory cards have become commonplace items for temporarily storing data -
everything from the portable flash memory cards used for transferring files, to semiconductor
memory cards used in cameras, mobile phones and the like.

The use of semiconductor memory has grown, and the size of these memory cards has increased
as the need for larger and larger amounts of storage is needed.

To meet the growing needs for semiconductor memory, there are many types and technologies
that are used. As the demand grows new memory technologies are being introduced and the
existing types and technologies are being further developed.

A variety of different memory technologies are available - each one suited to different
applications.. Names such as ROM, RAM, EPROM, EEPROM, Flash memory, DRAM, SRAM,
SDRAM, as well as F-RAM and MRAM are available, and new types are being developed to
enable improved performance.

Semiconductor memory: main types


There are two main types or categories that can be used for semiconductor technology. These
memory types or categories differentiate the memory to the way in which it operates:

 RAM - Random Access Memory: As the names suggest, the RAM or random access
memory is a form of semiconductor memory technology that is used for reading and writing
data in any order - in other words as it is required by the processor. It is used for such
applications as the computer or processor memory where variables and other stored and are
required on a random basis. Data is stored and read many times to and from this type of
memory.
 ROM - Read Only Memory: A ROM is a form of semiconductor memory technology used
where the data is written once and then not changed. In view of this it is used where data
needs to be stored permanently, even when the power is removed - many memory
technologies lose the data once the power is removed.

As a result, this type of semiconductor memory technology is widely used for storing programs
and data that must survive when a computer or processor is powered down. For example the
BIOS of a computer will be stored in ROM. As the name implies, data cannot be easily written
to ROM. Depending on the technology used in the ROM, writing the data into the ROM initially
may require special hardware. Although it is often possible to change the data, this gain
requires special hardware to erase the data ready for new data to be written in.
As can be seen, these two types of memory are very different.

Semiconductor memory technologies


There is a large variety of types of ROM and RAM that are available. Often the overall name for
the memory technology includes the initials RAM or ROM and this gives a guide as to the overall
type of format for the memory.

The different memory types or memory technologies are detailed below:

 DRAM: Dynamic RAM is a form of random access memory. DRAM uses a capacitor to
store each bit of data, and the level of charge on each capacitor determines whether that bit is
a logical 1 or 0. However these capacitors do not hold their charge indefinitely, and therefore
the data needs to be refreshed periodically. As a result of this dynamic refreshing it gains its
name of being a dynamic RAM. DRAM is the form of semiconductor memory that is often
used in equipment including personal computers and workstations where it forms the main
RAM for the computer. . . . . Read more about DRAM technology.
 EEPROM: This is an Electrically Erasable Programmable Read Only Memory. Data can be
written to it and it can be erased using an electrical voltage. This is typically applied to an
erase pin on the chip. Like other types of PROM, EEPROM retains the contents of the
memory even when the power is turned off. Also like other types of ROM, EEPROM is not as
fast as RAM. . . . . Read more about EEPROM technology.
 EPROM: This is an Erasable Programmable Read Only Memory. This form of
semiconductor memory can be programmed and then erased at a later time. This is normally
achieved by exposing the silicon to ultraviolet light. To enable this to happen there is a circular
window in the package of the EPROM to enable the light to reach the silicon of the chip. When
the PROM is in use, this window is normally covered by a label, especially when the data may
need to be preserved for an extended period.

The PROM stores its data as a charge on a capacitor. There is a charge storage capacitor for
each cell and this can be read repeatedly as required. However it is found that after many
years the charge may leak away and the data may be lost. Nevertheless, this type of
semiconductor memory used to be widely used in applications where a form of ROM was
required, but where the data needed to be changed periodically, as in a development
environment, or where quantities were low.
 Flash memory: Flash memory may be considered as a development of EEPROM
technology. Data can be written to it and it can be erased, although only in blocks, but data
can be read on an individual cell basis. To erase and re-programme areas of the chip,
programming voltages at levels that are available within electronic equipment are used. It is
also non-volatile, and this makes it particularly useful. As a result Flash memory is widely used
in many applications including memory cards for digital cameras, mobile phones, computer
memory sticks and many other applications. . . . . Read more about Flash memory
technology.
 F-RAM: Ferroelectric RAM is a random-access memory technology that has many
similarities to the standard DRAM technology. The major difference is that it incorporates a
ferroelectric layer instead of the more usual dielectric layer and this provides its non-volatile
capability. As it offers a non-volatile capability, F-RAM is a direct competitor to Flash. . . . .
Read more about FRAM memory.
 MRAM: This is Magneto-resistive RAM, or Magnetic RAM. It is a non-volatile RAM memory
technology that uses magnetic charges to store data instead of electric charges. Unlike
technologies including DRAM, which require a constant flow of electricity to maintain the
integrity of the data, MRAM retains data even when the power is removed. An additional
advantage is that it only requires low power for active operation. As a result this technology
could become a major player in the electronics industry now that production processes have
been developed to enable it to be produced. . . . . Read more about MRAM,
Magnetoresistive RAM.
 P-RAM / PCM: This type of semiconductor memory is known as Phase change Random
Access Memory, P-RAM or just Phase Change memory, PCM. It is based around a
phenomenon where a form of chalcogenide glass changes is state or phase between an
amorphous state (high resistance) and a polycrystalline state (low resistance). It is possible to
detect the state of an individual cell and hence use this for data storage. Currently this type of
memory has not been widely commercialised, but it is expected to be a competitor for flash
memory. . . . . Read more about Phase change memory, PRAM.
 PROM: This stands for Programmable Read Only Memory. It is a semiconductor memory
which can only have data written to it once - the data written to it is permanent. These
memories are bought in a blank format and they are programmed using a special PROM
programmer. Typically a PROM will consist of an array of fuseable links some of which are
"blown" during the programming process to provide the required data pattern.
 SDRAM: Synchronous DRAM. This form of semiconductor memory can run at faster
speeds than conventional DRAM. It is synchronised to the clock of the processor and is
capable of keeping two sets of memory addresses open simultaneously. By transferring data
alternately from one set of addresses, and then the other, SDRAM cuts down on the delays
associated with non-synchronous RAM, which must close one address bank before opening
the next. . . . . Read more about SDRAM, synchronous DRAM memory.
 SRAM: Static Random Access Memory. This form of semiconductor memory gains its
name from the fact that, unlike DRAM, the data does not need to be refreshed dynamically. It
is able to support faster read and write times than DRAM (typically 10 ns against 60 ns for
DRAM), and in addition its cycle time is much shorter because it does not need to pause
between accesses. However it consumes more power, is less dense and more expensive than
DRAM. As a result of this it is normally used for caches, while DRAM is used as the main
semiconductor memory technology. . . . . Read more about Static RAM, SRAM.

Semiconductor memory technology is developing at a fast rate to meet the ever growing needs of
the electronics industry. No only are the existing technologies themselves being developed, but
considerable amounts of research are being invested in new types of semiconductor memory
technology.

What is FRAM Memory: ferroelectric RAM


FRAM, ferroelectric RAM is a form of random access memory that combines speed & non-
volatility.

FRAM, ferroelectric RAM, is a form of random access memory that combines the fast read and
write access of dynamic RAM, DRAM whilst also providing non-volatile capability.

Ferroelectric RAM is also known as F-RAM or FeRAM, as and it is able to compete with Flash
technology in many areas, although there are several advantages and disadvantages to using it.

While the name FRAM or ferroelectric RAM seems to indicate that an iron element exists within
the memory this is not actually the case.
FRAM usage
Currently ferroelectric RAM is not as widely used as many of the more established technologies
including DRAM and Flash. These technologies have become well entrenched and their use is
widespread.

As developers often tend to rely on trusted technologies that are guaranteed to deliver the
performance they require, they are often reluctant to use technologies like FRAM that are not
guaranteed to deliver. Also issues like memory density that limit the size of memory available
have caused them not to be so widely used.

However FRAM technology is now being embedded into chips using CMOS technology to enable
MCUs to have their own FRAM memories. This requires fewer stages than the number required
for incorporating Flash memory onto MCU chips, thereby providing some significant cost
reductions.

A further advantage, apart from the non-volatile nature of the memory is its very low power
consumption which lends itself admirably to use within MCUs where power consumption is often
a key issue.

FRAM vs other memory technologies comparison


FRAM has characteristics that mean that it lends itself to many different uses. However it is useful
to be able to compare the performance and parameters of FRAM with other established memory
technologies.

COMPARISON OF MEMORY TECHNOLOGIES WITH FRAM


FRAM SRAM EEPROM FLASH
Non-volatile Yes No Yes Yes
Write endurance 1 million billion Unlimited ~500 000 1 000 000
(i.e. 1015)
Write speed (for 13 kB) 10ms <10ms 2s
Average active power 80 <60 Up to 10 mA 260
(µA/MHz)
Dynamics bit addressable Yes Yes No No
programmability
FRAM advantages and disadvantages
FRAM has a number of distinct advantages when compared to Flash memory which is its nearest
competitor. These need to be balanced against what may be termed its disadvantages when
considering its use in any system.

FRAM advantages compared to Flash


 Lower power usage
 Much larger number of write-erase cycles
 Faster write performance
FRAM disadvantages compared to Flash
 Lower storage density
 Higher cost
 Overall capacity limitation

FRAM is able to offer many advantages and can be used in many areas, but as in many cases,
the use of FRAM memory is a balance of a number of characteristics and parameters which need
to be made for any particular circuit design.

https://www.electronics-notes.com/articles/electronic_components/semiconductor-ic-
memory/fram-ferroelectric-ram-memory.php

You might also like